mioty Stack

The mioty® Protocol Stack is an extremely efficient and in particular robust solution for both, Low Power Wide Area Networks (LPWAN) and concentrated industrial networks. It implements the miniaturized Internet of Things (IoT) system mioty®, developed by Fraunhofer IIS. With the innovative technology of telegram-splitting, it sets new standards to the field of wireless data transmission and is highly flexible in application areas.

Telegram-Splitting

Traditional LPWAN Solutions

transmission of the whole data packet

  • interference issues and coexistence problems with other radio networks
  • Packet Error Rates (PER) over 10 % are common

Telegram-Splitting

transmission of data subpackets

  • message is divided into short subpackets at PHY level
  • Packet Error Rates (PER) < 1 %

A FEW FEATURE HIGHLIGHTS

EFFICIENT

  • transmission range up to 15 km in flat terrain and up to 5 km in urban terrain
  • up to 1,5 mil telegrams per day
  • operates at licence-free Sub-GHz spectrum
  • up to 1 mil sensors

FLEXIBLE

  • applicable for LPWAN or highly concentrated networks
  • independent of hardware
  • stationary or mobile application up to 120 km/h

ROBUST

  • innovative telegram-splitting technology
  • highly resistant to interference

innovative

  • implementing the new ETSI standard TS 103357

Flexible Interfaces

  • API for Application Layer for single chip solutions
    (API for other layers (e.g. DLL) possible)
  • API for externalization of security functions
  • well formed hardware abstraction layer (HAL)
  • available as library

Network Processor

  • well proven serial interface with minimal overhead
  • all API functions available via serial interface
  • serial interface supports UART, SPI, I2C, ...
  • AES encryption for serial interface

Support of hardware acceleration

If provided by the platform, the stack supports use of hardware acceleration, like

  • AES de-/encryption
  • CRC-16
  • de-/encoding of Manchester, 3 out of 6, ...

Support of any type of non-volatile memory

  • EEPROM, Flash, MRAM, ...
  • internal / external (e.g. connected via SPI)

COMMERCIAL FEATURES

  • first level support
  • easy commissioning and configuration
  • warranty and maintenance
  • ensures a high quality product

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